Digital Mini DFB BOSA (CSFP) UpDown 1.25Gbs 1310nm1490nm1550nm
BOSA
Model · Mini BOSA
The product is a point-to-point BOSA component with an upstream 1310nm/1490nm/1550nm wavelength/working rate of 1.25Gb/s and a downstream 1310/1490nm/1550nm operating rate of 1.25Gb/s.
- Wavelength
- 1310nm / 1490nm / 1550nm
- Data rate
- 1.25G
- Package
- BOSA
Product overview
Type:BOSA
Package Type:Receptacle
- The product is a point-to-point BOSA component with an upstream 1310nm/1490nm/1550nm wavelength/working rate of 1.25Gb/s and a downstream 1310/1490nm/1550nm operating rate of 1.25Gb/s.
- The starter uses a DFB laser and the receiving end uses a PIN-TIA diode.
Chip information:
LD: 1310nm/1490nm/1550nm 1.25Gpbs DFB 4PIN
PT: 1.25G PIN-TIA
- Product structure remarks: LC/PC ferrule assembly, machining/powder structure, receiving end adhesive structure, without isolator.
Standard
Packaging & Delivery
- Selling Units:Single item
- Single package size: 46X31X29 cm
- Single gross weight:5.0 kg
Package Type:
The outer box specification is 460*305*290mm, and each box can hold up to 640 products. 80 products are packed in 8 stacked; 8 anti-static trays can be loaded into 80 products.
Key features
- Laser welding solution
- Point-to-point application
- High optical isolation
- Working temperature: -40 ° C ~ 85 ° C
- Plug-in LC BOSA
Product details
- Model Number
- Mini BOSA
- Supply Ability
- 50K PCS/Month
Specifications
Specification
5 rows · Technical specifications
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| Parameter | Rating |
|---|---|
| Max. Forward Voltage | 2V |
| Max. Reverse Voltage | 15V |
| Max. Forward Current | 10mA |
| Max. Reverse Current | 150mA |
| Wavelength | Up 1.25Gbs 1310nm/1490nm/1550nm/ Down 1.25Gbs 1310/1490nm/1550nm |
Applications
- Remote communication
- Point to point communication
Standards & compliance
- Compliant with GR - 326 connector eligibility criteria
- Compliant with Telcordia GR-468 reliability test criterion
- Compliant with RoHS6 standard
Custom engineering
Need a different optical or mechanical configuration?
Share the target wavelength, output or sensitivity, package, connector or pigtail, temperature range, screening, quantity, and schedule for an engineering review.
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