BOSA

Digital DFBFP 1.25G2.5G LC BIDI BOSA with Receptacle Less than 40km

Model · DFB/FP BOSA

The product is a point-to-point BOSA component with an upstream 1310/1490nm/1550nm wavelength/operating rate of 155M,1.258G,2.5G, and a downstream 1490/1550nm/1310nm operating rate of 155M,1.258G, 2.5G.

Package: BOSA / RECEPTACLE
Interface: LC

Product overview

Type:BOSA

Package Type:Receptacle

The product is a point-to-point BOSA component with an upstream 1310/1490nm/1550nm wavelength/operating rate of 155M,1.258G,2.5G, and a downstream 1490/1550nm/1310nm operating rate of 155M,1.258G, 2.5G.
The DFB/FP laser is used at the origin, and the PIN-TIA diode is used at the receiving end.

Chip information:

LD: 1310nm/1490nm/1550nm 155M, 1.258G, 2.5G DFB/FP 4PIN

PT: 155M,1.258G,2.5G PIN-TIA

Product structure remarks: LC/PC ferrule assembly, machining/powder structure, receiving end adhesive structure, with isolator.

Standard

Packaging & Delivery

Selling Units:Single item
Single package size: 46X31X29 cm
Single gross weight:5.0 kg

Package Type:

The outer box specification is 460*305*290mm, and each box can hold up to 640 products. 80 products are packed in 8 stacked; 8 anti-static trays can be loaded into 80 products.

Key features

Laser welding solution
Point-to-point application
High optical isolation
Working temperature: 0°C~70°C
Receptacle LC BOSA

Product details

Model Number: DFB/FP BOSA
Supply Ability: 50K PCS/Month

Specifications

Specification5 rows · Technical specifications

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Specification for Digital DFBFP 1.25G2.5G LC BIDI BOSA with Receptacle Less than 40km
Parameter	Rating
Max. Forward Voltage	2V
Max. Reverse Voltage	15V
Max. Forward Current	2mA
Max. Reverse Current	120mA
Wavelength	UP 1310/1490nm/1550nm Down 1490/1550nm/1310nm

Applications

Remote communication
Point to point communication

Standards & compliance

Compliant with GR - 326 connector eligibility criteria
Compliant with Telcordia GR-468 reliability test criterion
Compliant with RoHS6 standard

Custom engineering

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