Digital DFBFP 1.25G2.5G LC BIDI BOSA with Receptacle Less than 40km
BOSA
Model · DFB/FP BOSA
The product is a point-to-point BOSA component with an upstream 1310/1490nm/1550nm wavelength/operating rate of 155M,1.258G,2.5G, and a downstream 1490/1550nm/1310nm operating rate of 155M,1.258G, 2.5G.
- Package
- BOSA / RECEPTACLE
- Interface
- LC
Product overview
Type:BOSA
Package Type:Receptacle
- The product is a point-to-point BOSA component with an upstream 1310/1490nm/1550nm wavelength/operating rate of 155M,1.258G,2.5G, and a downstream 1490/1550nm/1310nm operating rate of 155M,1.258G, 2.5G.
- The DFB/FP laser is used at the origin, and the PIN-TIA diode is used at the receiving end.
Chip information:
LD: 1310nm/1490nm/1550nm 155M, 1.258G, 2.5G DFB/FP 4PIN
PT: 155M,1.258G,2.5G PIN-TIA
- Product structure remarks: LC/PC ferrule assembly, machining/powder structure, receiving end adhesive structure, with isolator.
Standard
Packaging & Delivery
- Selling Units:Single item
- Single package size: 46X31X29 cm
- Single gross weight:5.0 kg
Package Type:
The outer box specification is 460*305*290mm, and each box can hold up to 640 products. 80 products are packed in 8 stacked; 8 anti-static trays can be loaded into 80 products.
Key features
- Laser welding solution
- Point-to-point application
- High optical isolation
- Working temperature: 0°C~70°C
- Receptacle LC BOSA
Product details
- Model Number
- DFB/FP BOSA
- Supply Ability
- 50K PCS/Month
Specifications
Specification
5 rows · Technical specifications
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| Parameter | Rating |
|---|---|
| Max. Forward Voltage | 2V |
| Max. Reverse Voltage | 15V |
| Max. Forward Current | 2mA |
| Max. Reverse Current | 120mA |
| Wavelength | UP 1310/1490nm/1550nm Down 1490/1550nm/1310nm |
Applications
- Remote communication
- Point to point communication
Standards & compliance
- Compliant with GR - 326 connector eligibility criteria
- Compliant with Telcordia GR-468 reliability test criterion
- Compliant with RoHS6 standard
Custom engineering
Need a different optical or mechanical configuration?
Share the target wavelength, output or sensitivity, package, connector or pigtail, temperature range, screening, quantity, and schedule for an engineering review.
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