BOSA

CSFP+ mini BOSA Digital DFB 10G Mini BOSA

Model · DFB 10G Mini BOSA

The product is a point-to-point BOSA component with an upstream 1310/1270nm wavelength/operating rate of 10.3125Gb/s and a downstream 1270/1330nm/operating rate of 10.3125Gb/s.

Wavelength: 1270nm / 1330nm
Data rate: 10G / 10.3125G
Package: BOSA

Product overview

Type:BOSA

Package Type:Receptacle

The product is a point-to-point BOSA component with an upstream 1310/1270nm wavelength/operating rate of 10.3125Gb/s and a downstream 1270/1330nm/operating rate of 10.3125Gb/s.
The starter uses a DFB laser and the receiving end uses a PIN-TIA diode.

Chip information:

LD: 1270nm/1330nm 10.3125Gpbs DFB 4PIN

PT: 10.3125Gpbs PIN-TIA

Product structure remarks: LC/PC ferrule assembly, machining/powder structure, receiving end adhesive structure, with isolator.

Standard

Single package size: 46X31X29 cm
Single gross weight:5.0 kg

Package Type:

The outer box specification is 460*305*290mm, and each box can hold up to 640 products. 80 products are packed in 8 stacked; 8 anti-static trays can be loaded into 80 products.

Key features

Laser welding solution
Point-to-point application
Uplink and downlink rates are 10.3125G
High optical isolation
Working temperature: -40 ° C ~ 85 ° C
Plug-in LC BOSA

Product details

Model Number: DFB 10G Mini BOSA
Supply Ability: 50K PCS/Month
Packaging Details: - Selling Units:Single item

Specifications

Specification6 rows · Technical specifications

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Specification for CSFP+ mini BOSA Digital DFB 10G Mini BOSA
Parameter	Rating
Max. Forward Voltage	2V
Max. Reverse Voltage	15V
Max. Forward Current	2mA
Max. Reverse Current	120mA
Wavelength	Up1310/1270nm Down1270/1330nm
Connector	SC FC ST

Applications

Remote communication
Point-to-point communication

Standards & compliance

Compliant with GR - 326 connector eligibility criteria
Compliant with Telcordia GR-468 reliability test criterion
Compliant with RoHS6 standard

Custom engineering

Need a different optical or mechanical configuration?

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