DTNT-Custom Laser Diode Suppliers and manufacturer

BOSA

Digital Mini DFB BOSA (CSFP) UpDown 1.25Gbs 1310nm1490nm1550nm

Item No.: 165
The product is a point-to-point BOSA component with an upstream 1310nm/1490nm/1550nm wavelength/working rate of 1.25Gb/s and a downstream 1310/1490nm/1550nm operating rate of 1.25Gb/s.
Description
Product details
Model Number:Mini BOSA
Type:BOSA
Package Type:Receptacle

Description
- The product is a point-to-point BOSA component with an upstream 1310nm/1490nm/1550nm wavelength/working rate of 1.25Gb/s and a downstream 1310/1490nm/1550nm operating rate of 1.25Gb/s.
- The starter uses a DFB laser and the receiving end uses a PIN-TIA diode.
- Chip information:
LD: 1310nm/1490nm/1550nm 1.25Gpbs DFB 4PIN
PT: 1.25G PIN-TIA
- Product structure remarks: LC/PC ferrule assembly, machining/powder structure, receiving end adhesive structure, without isolator.
Specification
ParameterRating
Max. Forward Voltage2V
Max. Reverse Voltage15V
Max. Forward Current10mA
Max. Reverse Current150mA
WavelengthUp 1.25Gbs 1310nm/1490nm/1550nm/
Down 1.25Gbs 1310/1490nm/1550nm
Features
- Laser welding solution
- Point-to-point application
- High optical isolation
- Working temperature: -40 ° C ~ 85 ° C
- Plug-in LC BOSA

Standard
- Compliant with GR - 326 connector eligibility criteria
- Compliant with Telcordia GR-468 reliability test criterion
- Compliant with RoHS6 standard

Application
- Remote communication
- Point to point communication

Supply Ability
50K PCS/Month

Packaging & Delivery
- Selling Units:Single item
- Single package size: 46X31X29 cm
- Single gross weight:5.0 kg
- Package Type:
The outer box specification is 460*305*290mm, and each box can hold up to 640 products. 80 products are packed in 8 stacked; 8 anti-static trays can be loaded into 80 products.