DTNT-Custom Laser Diode Suppliers and manufacturer

BOSA

Digital DFBFP 1.25G2.5G LC BIDI BOSA with Receptacle Less than 40km

Item No.: 163
Digital DFBFP 1.25G2.5G LC BIDI BOSA with Receptacle Less than 40km
Description
Product details
Model Number:DFB/FP BOSA
Type:BOSA
Package Type:Receptacle

Description
- The product is a point-to-point BOSA component with an upstream 1310/1490nm/1550nm wavelength/operating rate of 155M,1.258G,2.5G, and a downstream 1490/1550nm/1310nm operating rate of 155M,1.258G, 2.5G.
- The DFB/FP laser is used at the origin, and the PIN-TIA diode is used at the receiving end.
- Chip information:
LD: 1310nm/1490nm/1550nm 155M, 1.258G, 2.5G DFB/FP 4PIN
PT: 155M,1.258G,2.5G PIN-TIA
- Product structure remarks: LC/PC ferrule assembly, machining/powder structure, receiving end adhesive structure, with isolator.
Specification
ParameterRating
Max. Forward Voltage2V
Max. Reverse Voltage15V
Max. Forward Current2mA
Max. Reverse Current120mA
WavelengthUP 1310/1490nm/1550nm
Down 1490/1550nm/1310nm
Features
- Laser welding solution
- Point-to-point application
- High optical isolation
- Working temperature: 0°C~70°C
- Receptacle LC BOSA

Standard
- Compliant with GR - 326 connector eligibility criteria
- Compliant with Telcordia GR-468 reliability test criterion
- Compliant with RoHS6 standard

Application
- Remote communication
- Point to point communication

Supply Ability
50K PCS/Month

Packaging & Delivery
- Selling Units:Single item
- Single package size: 46X31X29 cm
- Single gross weight:5.0 kg
- Package Type:
The outer box specification is 460*305*290mm, and each box can hold up to 640 products. 80 products are packed in 8 stacked; 8 anti-static trays can be loaded into 80 products.